Chip Heat Dissipation

Diamond has unique advantages in chip heat dissipation due to its extremely high thermal conductivity and excellent thermal conductivity. In chip heat dissipation applications, diamond heat dissipation substrates are widely used for the heat dissipation of high-performance computer chips, optoelectronic devices, laser devices, and other high-power density devices to ensure their stable operation and long-term reliability under high loads.

The advantages of diamond heat dissipation substrates include:

·  High thermal conductivity: The thermal conductivity of diamond is several times or even tens of times that of traditional heat dissipation materials such as aluminum and copper, which can more effectively conduct the heat generated by the chip to the heat sink and improve the heat dissipation efficiency.
·  Excellent thermal conductivity: Diamond has excellent thermal conductivity, which can help the chip dissipate heat quickly, reduce operating temperature, and improve the stability and performance of the chip.
·  High temperature resistance: Diamond has excellent high temperature resistance and can maintain stable heat dissipation in high temperature environments, making it suitable for the heat dissipation needs of high-performance chips and devices.
·  Corrosion resistance and wear resistance: Diamond materials have good corrosion resistance and wear resistance, and can be stably applied in chip heat dissipation systems for a long time.